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The Model 400 Goniometer with Wafer Support has been designed uniquely for the semiconductor industry. This model shares components including the 3-axis stage with its little sister, the Standard Goniometer, as well as the long bench of the Advanced Goniometer. This system includes an 8" (200mm) diameter rotating wafer support which can be upgraded to 10" or 12" or even fitted with a 6" or 4" support. 6" and 8" diameter vacuum chucks are also available as an option. Additionally, custom support options can be built to customer requirements. Model 400 includes DROPimage Standard software and ships complete with PC and LCD. Popular options include the Automated Dispensing System and Manual Tilting Base. An affordable solution built on the time-proven ramé-hart design makes the Model 400 Goniometer popular with industry, especially chip fabricators or any lab that is working with wafers or similarly sized substrates. The DROPimage Standard software measures contact angle and includes a suite of surface energy tools including: the Acid-Base Tool, the Surface Energy Tool, the Work of Adhesion Tool, Zisman's Plot Tool, the Solid-Liquid-Liquid Surface Energy Tool, and the One-Liquid SE Tool. The software can be upgraded to DROPimage Advanced without any additional hardware required. The Manual Tilting Base option can also be added for measuring advancing and receding angles, determining roll-off angle, and calculating contact angle hysteresis. The Automated Tilting Base option requires a software upgrade to DROPimage Advanced. The Automated Dispensing System is fully supported with or without the software upgrade. What’s in the box: Goniometer 21" Bench with F4 Series Camera, 3-axis Stage, Leveling Stage, 8" diameter rotating wafer support, Fiber Optic Illuminator, PC, LCD, Camera Cable, (1) Microsyringe Assembly, (1) 22g Straight Needle, DROPimage Standard Software Single User License, Software User Manual, Setup Guide, Calibration Tool, and Storage Cover -- everything you need to get up and running taking contact angle and surface energy measurements. During the semiconductor manufacturing process this tool is used to measure the quality and uniformity of coatings and surface preparations. The large diameter form factor is also suitable for glass, hard disk platters, and other large flat surfaces.
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